Semiconductor chip fabrication method and apparatus therefor

Details Semiconductor chip fabrication method and apparatus therefor Semiconductor chip fabrication method and apparatus therefor

1997-12-09

2000-03-07

Booth, Richard

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438124, 438126, 438127, 438613, 438617, H01L 2144, H01L 2148, H01L 2150

Patent

active

060339349

ABSTRACT:
A semiconductor chip fabrication method, including the steps of: (a) attaching dies to a chip carrier and then bonding lead wires to the dies, (b) adhering heat-resisting plastic strips to the chip carrier and connecting them to each die at one corner for guiding a molten resin to the dies, (c) pouring a molten resin out of nozzles of a molding apparatus, permitting the molten resin to be guided by the heat-resisting plastic strips to the dies and then molded on the dies, and (d) marking the molded dies with marks and placing them with balls, and then separating the individually molded dies from one other.

REFERENCES:
patent: 5026669 (1991-06-01), Shinohara
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5869355 (1999-02-01), Fukaya
patent: 5885852 (1999-03-01), Kishikawa et al.
patent: 5897338 (1999-04-01), Kaldenberg

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