Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-12-23
2008-12-30
Whitmore, Stacy A (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000
Reexamination Certificate
active
07472363
ABSTRACT:
A thermally aware design automation suite integrates system-level thermal awareness into the design of semiconductor chips. A thermal analysis engine performs fine-grain thermal simulations of the semiconductor chip based on thermal models and boundary conditions for all thermally significant structures in the chip and the adjacent system that impact the temperature of the semiconductor chip. The thermally aware design automation suite uses the simulations of the thermal analysis engine to repair or otherwise modify the thermally significant structures to equalize temperature variations across the chip, impose specified design assertions on selected portions of the chip, and verify overall chip performance and reliability over designated operating ranges and manufacturing variations. The thermally significant structures are introduced or modified via one or more of: change in number, change in location, and change in material properties.
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Dyke Korbin Van
Gradient Design Automation Inc.
PatentVentures
Smith Bennett
Whitmore Stacy A
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