Semiconductor chip carrier package with a heat sink

Details Semiconductor chip carrier package with a heat sink Semiconductor chip carrier package with a heat sink

1983-03-09

1986-12-16

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 81, 361401, 361414, H05K 720

Patent

active

046301720

ABSTRACT:
A semiconductor chip carrier and contact array package having an apertured dielectric bottom layer (11), one or more chip connection layers such as wire bond layers (16, 17) insulated from one another, at least one chip-holding recess (24) in the wire bond layers and a heat conductive copper heat sink insert (26) extending across the aperture of the dielectric layer and forming a base adapted to be in heat-conductive contact with the bottom of an integrated circuit chip (27) to be attached thereon whereby heat flux generated by the chip is quickly and efficiently removed from the chip body. The wire bond layers (16, 17) contains metallization patterns (29) for bonding to the chip and a grid array of contacts or connection pins (20) connected to plated through-holes in the wire bond layer(s) for plugging the carrier to a circuit board or the like. The various layers of the carrier per se are manufactured by predrilling and aperturing, forming the metallization patterns, stacking and pressure laminating to form a reliable compact structure having high heat dissipation properties.

REFERENCES:
patent: 2942165 (1921-05-01), Jackson et al.
patent: 3365620 (1968-01-01), Butler et al.
patent: 3436604 (1969-04-01), Hyltin et al.
patent: 3436819 (1969-04-01), Lunine
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 3846824 (1974-11-01), Bell
patent: 3958195 (1976-05-01), Johnson
patent: 4338621 (1982-07-01), Braun

Affiliated with

Also associated with

Rating

Semiconductor chip carrier package with a heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor chip carrier package with a heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip carrier package with a heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-249257