Semiconductor chip carrier assembly

Details Semiconductor chip carrier assembly Semiconductor chip carrier assembly

1997-04-22

1999-10-26

Tran, Minh Loan

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

257669, 257676, 257738, 257701, H01L 2302

Patent

active

059733896

ABSTRACT:
A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.

REFERENCES:
patent: 4687280 (1987-08-01), Toy
patent: 5386341 (1995-01-01), Olson et al.
patent: 5435732 (1995-07-01), Angulas et al.
patent: 5438223 (1995-08-01), Higashi et al.
patent: 5512360 (1996-04-01), King
patent: 5611884 (1997-03-01), Bearinger et al.
patent: 5760465 (1998-06-01), Alcoe et al.

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