Semiconductor chip card having selective encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package

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Details

257787, 174 522, 174 524, 29829, H01L 2302, H05K 300

Patent

active

055856691

ABSTRACT:
A chip card including a card base with a recess. A circuit support and a microcircuit is arranged on a circuit support surface which faces an interior of the recess and is spaced from the recess bottom. A raised portion is formed on the recess bottom and spaced from a cover section so as to divide the recess into two regions bounded by the recess bottom, the cover section and the raised portion. The first region is completely filled with an encapsulant and the second region is partly filled with the encapsulant.

REFERENCES:
patent: 4483067 (1984-11-01), Parmentier
patent: 4649418 (1987-03-01), Uden
patent: 4701236 (1987-10-01), Vieilledent

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