Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent
1995-05-18
1996-12-17
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
257787, 174 522, 174 524, 29829, H01L 2302, H05K 300
Patent
active
055856691
ABSTRACT:
A chip card including a card base with a recess. A circuit support and a microcircuit is arranged on a circuit support surface which faces an interior of the recess and is spaced from the recess bottom. A raised portion is formed on the recess bottom and spaced from a cover section so as to divide the recess into two regions bounded by the recess bottom, the cover section and the raised portion. The first region is completely filled with an encapsulant and the second region is partly filled with the encapsulant.
REFERENCES:
patent: 4483067 (1984-11-01), Parmentier
patent: 4649418 (1987-03-01), Uden
patent: 4701236 (1987-10-01), Vieilledent
Jr. Carl Whitehead
Schaier Arthur G.
U.S. Philips Corporation
LandOfFree
Semiconductor chip card having selective encapsulation does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor chip card having selective encapsulation, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip card having selective encapsulation will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1993658