Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2007-09-25
2007-09-25
Owens, Douglas W. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257S784000, C257S780000, C257S781000
Reexamination Certificate
active
10904540
ABSTRACT:
A semiconductor chip capable of implementing wire bonding over active circuits (BOAC) is provided. The semiconductor chip includes a bonding pad structure, a metal-metal capacitor formed by at least a pair of metal electrodes on the same plane underneath the bonding pad structure, at least an interconnection metal layer, at least a via plug between the interconnection metal layer and the bonding pad structure, and an active circuit situated underneath the bonding pad structure on a semiconductor bottom.
REFERENCES:
patent: 5173671 (1992-12-01), Wendler
patent: 5751065 (1998-05-01), Chittipeddi et al.
patent: 6022797 (2000-02-01), Ogasawara et al.
patent: 6297563 (2001-10-01), Yamaha
patent: 6362528 (2002-03-01), Anand
patent: 6414390 (2002-07-01), Nozawa
patent: 6417575 (2002-07-01), Harada et al.
patent: 6476459 (2002-11-01), Lee
patent: 6495918 (2002-12-01), Brintzinger
patent: 6522021 (2003-02-01), Sakihama et al.
patent: 6727590 (2004-04-01), Izumitani et al.
patent: 6897570 (2005-05-01), Nakajima et al.
patent: 6900541 (2005-05-01), Wang et al.
patent: 2001/0010408 (2001-08-01), Ker et al.
patent: 2003/0094634 (2003-05-01), Cho et al.
patent: 2006/0097406 (2006-05-01), Wu et al.
Hsu Winston
Nguyen Tram H
Owens Douglas W.
United Microelectronics Corp.
LandOfFree
Semiconductor chip capable of implementing wire bonding over... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor chip capable of implementing wire bonding over..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor chip capable of implementing wire bonding over... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3768583