Semiconductor chip bonding process

Details Semiconductor chip bonding process Semiconductor chip bonding process

1991-09-09

1993-02-16

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

2281802, 228175, H01L 2160

Patent

active

051863812

ABSTRACT:
A semiconductor chip bonding process is disclosed, and the process comprises the steps of forming a first Au ball using a wire ball bump bonding apparatus, stacking a second Au ball on the first Au ball, stacking a Pb ball on the second Au ball using the wire ball bump bonding apparatus, and bonding the chip to a substrate, wherein the conventional complicated BUMP manufacturing process is omitted due to the CHIP BONDING technique during the assembling process, so that the formation process is shortened and the defect rate during the chip bonding is minimized, thereby the manufacturing cost can be saved.

REFERENCES:
patent: 509019 (1992-02-01), Tsuda et al.
patent: 3986255 (1976-10-01), Mandal
patent: 4661192 (1987-04-01), McShane
patent: 4750666 (1988-06-01), Neugebauer
patent: 4875617 (1989-10-01), Citowsky
patent: 4875618 (1989-10-01), Hasegawa
patent: 4889274 (1989-12-01), Ramsey
patent: 5090609 (1992-02-01), Nakao et al.

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