Semiconductor chip assembly with post/base heat spreader and...

Details Semiconductor chip assembly with post/base heat spreader and... Semiconductor chip assembly with post/base heat spreader and...

2009-11-11

2011-11-29

Bryant, Kiesha (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S712000, C257SE33075

Reexamination Certificate

active

08067784

ABSTRACT:
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally connected to the heat spreader. The heat spreader includes a post and a base. The post extends upwardly from the base into an opening in the adhesive and an aperture in the substrate, and the base extends laterally from the post. The adhesive extends between the post and the substrate and between the base and the substrate. The assembly provides signal routing between a pad and a terminal.

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