Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Substrate dicing
Reexamination Certificate
2007-04-03
2007-04-03
Graybill, David E. (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Substrate dicing
C438S068000, C438S113000, C438S114000, C438S458000, C438S460000, C438S461000, C438S462000, C438S463000, C438S464000, C438S465000
Reexamination Certificate
active
09656690
ABSTRACT:
Semiconductor chip assemblies incorporating flexible, sheet-like elements having terminals thereon overlying the front or rear face of the chip to provide a compact unit. The terminals on the sheet-like element are movable with respect to the chip, so as to compensate for thermal expansion. A resilient element such as a compliant layer interposed between the chip and terminals permits independent movement of the individual terminals toward the chip driving engagement with a test probe assembly so as to permit reliable engagement despite tolerances.
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Distefano Thomas H.
Khandros Igor Y.
Graybill David E.
Lerner David Littenberg Krumholz & Mentlik LLP
Tessera Inc.
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