4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Thomas H. Distefano

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Compliant semiconductor chip package with fan-out leads and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Connecting multiple microelectronic elements with lead...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Electrical connection with inwardly deformable contacts

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Face-up semiconductor chip assemblies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Laterally situated stress/strain relieving lead for a...

Semiconductor device manufacturing: process – Making device array and selectively interconnecting
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2433707

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