Semiconductor chip and TAB package having the same

Details Semiconductor chip and TAB package having the same Semiconductor chip and TAB package having the same

2008-01-09

2010-06-08

Louie, Wai-Sing (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S772000

Reexamination Certificate

active

07732933

ABSTRACT:
A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.

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