Semiconductor chip and process for forming the same

Details Semiconductor chip and process for forming the same Semiconductor chip and process for forming the same

2011-04-26

2011-04-26

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S623000, C438S636000, C438S656000, C438S687000, C257SE21585, C257SE21586, C257SE23145, C257SE27096

Reexamination Certificate

active

07932172

ABSTRACT:
A semiconductor chip comprises a first MOS device, a second MOS device, a first metallization structure connected to said first MOS device, a second metallization structure connected to said second MOS device, a passivation layer over said first and second MOS devices and over said first and second metallization structures, and a third metallization structure connecting said first and second metallization structures.

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