Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
Patent
1998-02-06
2000-08-22
Picardat, Kevin M.
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having specified scribe region structure
438113, 438460, H01L 2146
Patent
active
061071617
ABSTRACT:
It is an object of the present invention to provide a semiconductor chip which is hard to be damaged when the semiconductor chip is cut out from a sheet of wafer for semiconductor and a method for manufacturing thereof. Cutting grooves 26 having a wider width than scribing lines (lines for carrying out scribing) 24 which is cut by a dicing saw are formed on the upper part of the wafer 20. That is, walls 32 of the cutting grooves 26 are set back from cutting planes 30 in side walls 28 of die 22 thus cut out. So that, there is only a slight probability of contact of the dicing saw with the walls 32 of the cutting grooves 26 when the wafer 20 is cut along the center of the cutting grooves 26 with the dicing saw. As a result, it is possible to prevent chips of the upper part of the dies 22 caused by a blade of the dicing saw.
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Kadonishi Hiroshi
Kitaguro Koichi
Picardat Kevin M.
Rohm & Co., Ltd.
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