Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Patent
1998-03-04
2000-04-18
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
With means to control surface effects
Insulating coating
257620, 257634, H01L 2358
Patent
active
060518758
ABSTRACT:
A method of processing a semiconductive material wafer includes, a) providing a semiconductive material wafer having integrated circuitry fabricated within discrete die areas on the wafer, the discrete die areas having bond pads formed therewithin; b) cutting at least partially into the semiconductive material wafer about the die areas to form a series of die cuts, the cuts having edges; c) depositing an insulative material over the wafer and to within the cuts to at least partially cover the cut edges and to at least partially fill the cuts with the insulative material; d) removing the insulative material from being received over the bond pads and leaving the insulative material within the die cuts; and e) after the removing, cutting into and through the insulative material within the die cuts and through the wafer. A semiconductor chip includes an outer surface having conductive bond pads proximately associated therewith. Side edges extend from the outer surface. An insulating material layer is adhered to at least a portion of the side edges and not formed over the bond pads. The insulative material layer can be continuous and adhered to only a portion of the outer surface and adhered to at least a portion of the side edges. The insulative material preferably has a thickness of between 100 Angstroms and 100 microns.
REFERENCES:
patent: 4075632 (1978-02-01), Baldwin et al.
patent: 4926182 (1990-05-01), Ohta et al.
patent: 5169804 (1992-12-01), Schwartzbauer
patent: 5391915 (1995-02-01), Mukai et al.
patent: 5455455 (1995-10-01), Badehi
patent: 5501104 (1996-03-01), Ikeda et al.
patent: 5583370 (1996-12-01), Higgins, III et al.
patent: 5621412 (1997-04-01), Sharpe et al.
patent: 5649296 (1997-07-01), MacLellan et al.
patent: 5903044 (1999-05-01), Farnworth et al.
Jr. Carl Whitehead
Micro)n Technology, Inc.
Potter Roy
LandOfFree
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