Semiconductor card package and method of forming the same

Details Semiconductor card package and method of forming the same Semiconductor card package and method of forming the same

2007-11-12

2010-12-21

Luu, Chuong A. (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S679000, C257S787000, C257S680000

Reexamination Certificate

active

07855441

ABSTRACT:
A semiconductor card package and a method of manufacturing the semiconductor cared package are provided. The package may include a housing having a cavity. The cavity may have a size corresponding to at least one standard semiconductor package. External terminals may be exposed on the outside of the housing. Internal terminals may be disposed in the cavity. At least one internal semiconductor package may be inserted into the cavity. The internal semiconductor package includes I/O terminals. Each of the I/O terminals is connected to a corresponding one of the internal terminals.

REFERENCES:
patent: 6538331 (2003-03-01), Masuda et al.
patent: 6963135 (2005-11-01), Chiang et al.
patent: 7508070 (2009-03-01), Chiang
patent: 2003/0155659 (2003-08-01), Verma et al.
patent: 2006/0108674 (2006-05-01), Liou et al.
patent: 9-1972 (1997-01-01), None
patent: 2001-217383 (2001-08-01), None
patent: 2007-005443 (2007-01-01), None
patent: 2001-0081699 (2001-08-01), None
patent: 10-2004-0014185 (2004-02-01), None
patent: 10-2004-0037268 (2004-05-01), None
English language abstract of Japanese Publication No. 9-1972.
English language abstract of Japanese Publication No. 2001-217383.
English language abstract of Korean Publication No. 2001-0081699.
JEDEC Standard No. JESD84-A41, “Embedded MultiMediaCard (eMMC) Product Standard, Standard Capacity,” Jun. 2007, JEDEC Solid State Technology Association, Arlington, VA.

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