Semiconductor BGA package having a segmented voltage plane...

Details Semiconductor BGA package having a segmented voltage plane... Semiconductor BGA package having a segmented voltage plane...

2007-06-19

2007-06-19

Lewis, Monica (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S738000, C257S780000

Reexamination Certificate

active

10797647

ABSTRACT:
A semiconductor device assembly and method of making the devices are disclosed. The assembly comprises a semiconductor die attached to an electrically conductive layer, which is, in turn, connected to a dielectric layer carrying conductive traces of the electrical connection layer. The conductive traces provide connection between an array of discrete conductive elements and bonding wires connected to bond pads of the die. The conductive layer enhances thermal conduction and structural stiffness for the assembly. In addition, the conductive layer provides a voltage reference plane that may be connected to a power source, a ground source, or an intermediate reference voltage. The conductive layer also includes at least one electrical current isolation slot, which segments the conductive layer to help isolate noise induced in one segment of the conductive layer from the other segments.

REFERENCES:
patent: 5895967 (1999-04-01), Stearns et al.
patent: 6268650 (2001-07-01), Kisnman et al.
patent: 6300165 (2001-10-01), Castro
patent: 6534861 (2003-03-01), Castro
patent: 2002/0008307 (2002-01-01), Dickey
patent: 2002/0121688 (2002-09-01), Kinsman et al.
Merriam-Webster Online Dictionary www.m-w.com.

Affiliated with

Also associated with

Rating

Semiconductor BGA package having a segmented voltage plane... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor BGA package having a segmented voltage plane..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor BGA package having a segmented voltage plane... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3885976