Semiconductor assembly without adhesive fillets

Details Semiconductor assembly without adhesive fillets Semiconductor assembly without adhesive fillets

2005-05-31

2005-05-31

Eckert, George (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S685000, C257S686000, C257S777000, C257S707000, C438S108000, C438S109000, C361S760000

Reexamination Certificate

active

06900549

ABSTRACT:
Disclosed is a method for forming a semiconductor assembly and the resulting assembly in which a flowable adhesive material which secures a die to a support and does not form an adhesive fillet. A flowable adhesive is deposited between the die and support so that it covers about 50 to about 90 percent of the bottom surface area of the die after the die is mounted to the support. The reduced surface coverage area prevents formation of an adhesive fillet.

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