Semiconductor assembly having laminated semiconductor devices

Details Semiconductor assembly having laminated semiconductor devices Semiconductor assembly having laminated semiconductor devices

1994-09-28

1996-04-16

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

257692, H01L 2348, H01L 2352, H01L 2940

Patent

active

055085636

ABSTRACT:
A semiconductor assembly comprises first and second containers which contain respective semiconductor chips and are stacked one over another. First and second external leads extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other. The first and the second containers may be provided at corresponding positions with a recess and a projection to be engaged each other for positional alignment. There may be provided first and second heat radiating plates extending from the insides of the respective containers to outside thereof are bent so as to be connected to each other.

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