Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2007-07-24
2007-07-24
Parker, Kenneth (Department: 2815)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S125000, C438S126000, C438S127000, C257SE23128, C257SE21502
Reexamination Certificate
active
10919373
ABSTRACT:
An encapsulation mold for forming an encapsulation layer over a semiconductor assembly is disclosed. A semiconductor assembly with multiple semiconductor dies secured to a single semiconductor support structure is inserted into an encapsulation mold. The mold contains a first section and a second section, which form a cavity around the assembly. The mold contains an aperture for transferring encapsulating material into the mold cavity. One of the mold sections has a design feature, such as a raised rib or groove interconnecting at approximately the separation or saw-cut regions of the individual dies of the assembly. Encapsulation material is inserted into the mold cavity until the cavity is filled. The mold section design feature shapes the top surface of the encapsulation layer. The mold is removed leaving the exterior surface of the encapsulation layer patterned with the design feature. The assembly is then separated into individual dies along the design feature boundary of the encapsulation layer's exterior surface.
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Dickstein & Shapiro LLP
Micro)n Technology, Inc.
Parker Kenneth
Warren Matthew E.
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