Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2005-01-11
2005-01-11
Smith, Matthew (Department: 2825)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C438S112000, C257S787000, C257S730000
Reexamination Certificate
active
06841424
ABSTRACT:
An encapsulation mold for forming an encapsulation layer over a semiconductor assembly is disclosed. A semiconductor assembly with multiple semiconductor dies secured to a single semiconductor support structure is inserted into an encapsulation mold. The mold contains a first section and a second section, which form a cavity around the assembly. The mold contains an aperture for transferring encapsulating material into the mold cavity. One of the mold sections has a design feature, such as a raised rib or groove interconnecting at approximately the separation or saw-cut regions of the individual dies of the assembly. Encapsulation material is inserted into the mold cavity until the cavity is filled. The mold section design feature shapes the top surface of the encapsulation layer. The mold is removed leaving the exterior surface of the encapsulation layer patterned with the design feature. The assembly is then separated into individual dies along the design feature boundary of the encapsulation layer's exterior surface.
REFERENCES:
patent: 5214846 (1993-06-01), Asami et al.
patent: 6081978 (2000-07-01), Utsumi et al.
patent: 6173490 (2001-01-01), Lee et al.
patent: 6184465 (2001-02-01), Corisis
patent: 6541310 (2003-04-01), Lo et al.
patent: 20020014693 (2002-02-01), Pollack
patent: 11-87433 (1999-03-01), None
US-2002/0014693 A1, Feb. 2002, Pollack, patent application.
Dickstein , Shapiro, Morin & Oshinsky, LLP
Lee Calvin
Micro)n Technology, Inc.
Smith Matthew
LandOfFree
Semiconductor assembly encapsulation mold and method for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor assembly encapsulation mold and method for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor assembly encapsulation mold and method for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3381539