Semiconductor assemblies having electrophoretically...

Details Semiconductor assemblies having electrophoretically... Semiconductor assemblies having electrophoretically...

2006-09-12

2006-09-12

Smith, Bradley K. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE25011

Reexamination Certificate

active

07105921

ABSTRACT:
Methods are provided for creating lined vias in semiconductor substrates. Using electrophoretic deposition techniques, micelles of a lining material are deposited on the wall of the via, reacting with the surface of the wall until the entire wall is covered by the lining material. The lining material is then fixed in place to form a layer lining the via. The lined via may then be filled with a desired material. For example, a via lined with an insulative material may be filled with a material such as copper to create an insulated conductive via through the substrate.

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