Semiconductor apparatus with decoupling capacitor

Details Semiconductor apparatus with decoupling capacitor Semiconductor apparatus with decoupling capacitor

2007-02-06

2007-02-06

Ha, Nathan (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S666000

Reexamination Certificate

active

10954588

ABSTRACT:
A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power supply terminals, in which a pair of adjacent inner leads for power supply terminal and ground terminal are extended inwardly; a chip capacitor mounting pad which is provided at inner ends of the extended inner leads; and a chip capacitor which is mounted on the chip capacitor mounting pad so that a decoupling capacitor is provided.

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