Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1992-01-21
1993-09-28
LaRoche, Eugene R.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257669, 257673, 257676, 257787, H01L 2348
Patent
active
052488950
ABSTRACT:
A semiconductor apparatus with high thermal radiating property and a method for producing the same is provided. The semiconductor apparatus comprises a TAB tape 11 having an inner wire 13 and a middle wire; a semiconductor chip 1 connected to the inner wire 13 through a bump 12; and a lead frame 3 having as an integral structure a middle lead connected to the middle wire 14 and a metallic bed 5 in contact with the semiconductor chip 1. The shape of the bed 5 is nearly constant regardless of the size of the semiconductor chip 1. The bed 5 extends nearly to each outer edge of a sealing plastic resin 2. The heat generated in the semiconductor chip 1 is effectively radiated to the outside through the extending bed 5 of the lead frame 3.
REFERENCES:
patent: 4147889 (1979-04-01), Andrews et al.
patent: 4330790 (1982-05-01), Burns
patent: 4459607 (1984-07-01), Reid
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4839713 (1989-06-01), Teraoka et al.
patent: 5031022 (1991-07-01), Yamamoto et al.
Kabushiki Kaisha Toshiba
LaRoche Eugene R.
Nguyen Viet Q.
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