Semiconductor apparatus having a leadframe with coated leads

Details Semiconductor apparatus having a leadframe with coated leads Semiconductor apparatus having a leadframe with coated leads

1997-10-24

1999-07-13

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257670, 257734, H01L 23495

Patent

active

059230800

ABSTRACT:
A semiconductor apparatus having an insulation coating section at an outer section of an outer lead so as to reduce the number of inferior products at the time of bonding a fine pitch outer lead, which includes an insulation coating section formed at an outer portion of an outer lead of a TAB tape so as to prevent electric short between outer leads which occurs due to a conduction ball contained in ACA/ACF during a TAB outer lead bonding.

REFERENCES:
patent: 4731282 (1988-03-01), Tsukagoshi et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 5051813 (1991-09-01), Schneider et al.
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5176366 (1993-01-01), Masumoto et al.
patent: 5412157 (1995-05-01), Yagoura et al.
patent: 5530282 (1996-06-01), Tsuji

Affiliated with

Also associated with

Rating

Semiconductor apparatus having a leadframe with coated leads does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor apparatus having a leadframe with coated leads, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor apparatus having a leadframe with coated leads will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2278157