Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-02-26
2000-04-25
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257690, 257692, 257778, H01L 2348
Patent
active
06054757&
ABSTRACT:
A semiconductor apparatus includes a semiconductor chip contained in a package; a first set of connection terminals, of which one ends are connected to the semiconductor chip and the other ends are connected onto a first connection plane outside of the package; and a second set of connection terminals, of which one ends are connected to the semiconductor chip and the other ends are connected onto a second connection plane outside of the package. The first and second connection planes are electrically connected to a circuit board.
REFERENCES:
patent: 4530002 (1985-07-01), Kanai
patent: 5157480 (1992-10-01), McShane et al.
patent: 5306948 (1994-04-01), Yamada et al.
patent: 5450289 (1995-09-01), Kweon et al.
patent: 5563446 (1996-10-01), Chia et al.
patent: 5789811 (1998-08-01), Chia et al.
A Mixed Solder Grid Array and Peripheral Leaded MCM Package, Hashemi et al., Institute of Electrical and Electronics Engineers, Proceedings of the Electronic Components and Technology Conference, Orlando, Jun. 1-4, 1993, pp. 951-956.
Jr. Carl Whitehead
OKI Electric Industry Co., Ltd.
Potter Roy
LandOfFree
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