Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1998-02-20
2000-10-31
Dutton, Brian
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438657, H01L 2144
Patent
active
06140229&
ABSTRACT:
A semiconductor apparatus having at least a compound film containing nitrogen and a method for production of the same, wherein the compound film containing nitrogen is formed under conditions where the ratio of the flow rates of the nitrogen with respect to an inert gas is 0.125 to 1.0.
REFERENCES:
patent: 5340459 (1994-08-01), Takehara
patent: 5439574 (1995-08-01), Kobayashi et al.
patent: 5581125 (1996-12-01), Maeda
Dutton Brian
Sony Corporation
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