Semiconductor apparatus and method of manufacturing the same

Details Semiconductor apparatus and method of manufacturing the same Semiconductor apparatus and method of manufacturing the same

2008-07-15

2010-02-16

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S787000, C438S127000

Reexamination Certificate

active

07663254

ABSTRACT:
There is provided a semiconductor apparatus which includes a substrate, a semiconductor chip mounted above the substrate, a first resin filled between the substrate and the semiconductor chip, and a second resin formed on the substrate and extending from a side surface of the semiconductor chip toward an outer edge of the substrate. The second resin extends from an intersection of an extension of the side surface of the semiconductor chip and the substrate toward the outer edge of the substrate so that a first stress generated on a contact surface between the first resin and the semiconductor chip and a second stress generated on a contact surface between the first resin or the second resin and the substrate balance out each other.

REFERENCES:
patent: 5864178 (1999-01-01), Yamada et al.
patent: 6093972 (2000-07-01), Carney et al.
patent: 6144107 (2000-11-01), Narita
patent: 6224711 (2001-05-01), Carden et al.
patent: 6265768 (2001-07-01), Su et al.
patent: 6265784 (2001-07-01), Kawano et al.
patent: 6407461 (2002-06-01), Farquhar et al.
patent: 6661104 (2003-12-01), Jiang et al.
patent: 7274110 (2007-09-01), Meyer et al.
patent: 7417330 (2008-08-01), Wakabayashi et al.
patent: 2004/0150118 (2004-08-01), Honda
patent: 2009/0197370 (2009-08-01), Katsura et al.
patent: 2000-200870 (2000-07-01), None
patent: 2000-315698 (2000-11-01), None
patent: 2004-260138 (2004-09-01), None

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