Semiconductor apparatus and method for manufacturing the same

Details Semiconductor apparatus and method for manufacturing the same Semiconductor apparatus and method for manufacturing the same

2011-01-25

2011-01-25

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S050000, C438S055000, C438S107000, C438S108000, C438S110000, C438S458000, C438S464000

Reexamination Certificate

active

07875481

ABSTRACT:
It is made possible to provide a highly integrated, thin apparatus can be obtained, even if the apparatus contains MEMS devices and semiconductor devices. A semiconductor apparatus includes: a first chip comprising a MEMS device formed therein; a second chip comprising a semiconductor device formed therein; and an adhesive layer bonding a side face of the first chip to a side face of the second chip, and having a lower Young's modulus than the material of the first and second chips.

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