Semiconductor apparatus and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Reexamination Certificate

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C257S669000, C257S674000, C257S690000, C257S692000, C257S693000, C257S694000, C257S695000, C257S696000, C257SE23031, C257SE23045, C257SE23046, C257SE23047, C257SE23048

Reexamination Certificate

active

10212171

ABSTRACT:
A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around the semiconductor pellet and upper parts of the lead terminals. The plurality of lead terminals are shaped to be elongated strips and are arranged to extend out of the molding member toward the substrate.

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patent: 7057273 (2006-06-01), Harnden et al.
patent: 1-113359 (1989-07-01), None
patent: 04-256351 (1992-09-01), None
patent: 05-291460 (1993-11-01), None
patent: 2000-252389 (2000-09-01), None

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