Semiconductor apparatus and fabrication method of the same

Details Semiconductor apparatus and fabrication method of the same Semiconductor apparatus and fabrication method of the same

2006-06-27

2006-06-27

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S106000, C438S149000, C438S107000, C438S459000

Reexamination Certificate

active

07067392

ABSTRACT:
It is an object of the present invention to provide a semiconductor device capable of preventing deterioration due to penetration of moisture or oxygen, for example, a light-emitting apparatus having an organic light-emitting device that is formed over a plastic substrate, and a liquid crystal display apparatus using a plastic substrate. According to the present invention, devices formed on a glass substrate or a quartz substrate (a TFT, a light-emitting device having an organic compound, a liquid crystal device, a memory device, a thin-film diode, a pin-junction silicon photoelectric converter, a silicon resistance element, or the like) are separated from the substrate, and transferred to a plastic substrate having high thermal conductivity.

REFERENCES:
patent: 5757456 (1998-05-01), Yamazaki et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 2003/0025118 (2003-02-01), Yamazaki et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2003/0047280 (2003-03-01), Takayama et al.
patent: 2003/0064569 (2003-04-01), Takayama et al.
patent: 2003/0082889 (2003-05-01), Maruyama et al.
patent: 2003/0134488 (2003-07-01), Yamazaki et al.
patent: 2003/0217805 (2003-11-01), Takayama et al.
patent: 2004/0087110 (2004-05-01), Takayama et al.
patent: 2004/0169786 (2004-09-01), Yamazaki et al.
patent: 2004/0238827 (2004-12-01), Takayama et al.
patent: 2005/0164470 (2005-07-01), Yamazaki et al.
patent: 2001-331120 (2001-11-01), None
patent: 2003-204049 (2003-07-01), None
International Search Report (Application No. PCT/JP03/13068) dated Jan. 27, 2004; 4 pages.

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