Measuring and testing – Speed – velocity – or acceleration – Structural installation or mounting means
Patent
1997-09-19
2000-02-08
Chapman, John E.
Measuring and testing
Speed, velocity, or acceleration
Structural installation or mounting means
7351432, G01P 1508
Patent
active
060216700
ABSTRACT:
Provided is a semiconductor acceleration detecting device capable of improving the impact resistance in handling the device singly with a relatively simple construction without providing any other member. The device is a semiconductor acceleration detecting device S1 having a construction in which a package body Pc formed by mounting an acceleration detecting semiconductor chip on a die pad and molding it with the lead terminal sections Tr of lead pins protruding outward is combined by bonding with a main body section Bd, so that the device is totally formed into an approximately rectangular parallelepiped shape comprised of a pair of first surfaces F1 from which the lead terminal sections are protruding, a pair of second surfaces F2 approximately perpendicular to a suspension lead, and a pair of third surfaces F3 approximately parallel to the die pad. Remaining suspension leads A1, B1 and C1 are made to protrude from the second surfaces F2, and at least one of the protruding remaining suspension leads A1, B1 and C1 is bent so that its leading end protrudes outwardly of the third surface F3.
REFERENCES:
patent: 5394751 (1995-03-01), Ishibashi
patent: 5604363 (1997-02-01), Ichihashi
patent: 5616954 (1997-04-01), Tobase
Chapman John E.
Mitsubishi Denki & Kabushiki Kaisha
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