Semi-subtractive circuitization

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430313, 430318, 430327, G03F 700

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054278953

ABSTRACT:
A process for selective plating of a metal onto a substrate surface is provided. The process includes laminating a layer of conductive metal onto a dielectric substrate; and providing thru holes extending through said layer of conductive metal and said dielectric substrate.
A thin layer of conductive metal is plated on the walls of the thru holes; and a photoresist layer is applied to the surface of the conductive metal and selectively exposed and developed to provide a mask corresponding to the negative of the desired circuit pattern.
The exposed metal that is not covered by the photoresist is removed and then the remaining photoresist is removed to thereby provide the desired circuit pattern. A conductive metal is plated on the pattern up to the desired thickness.

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