Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-11-27
2007-11-27
Thompson, Gregory D (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C165S080200, C165S185000, C165S080400, C361S696000, C361S699000, C257S719000
Reexamination Certificate
active
10945807
ABSTRACT:
A heat collection apparatus is mounted to the heat source using a gimbal plate, which includes a gimbal joint. The gimbal joint enables application of a retaining force to the heat collection apparatus as a single-point load. The retaining force is applied along a vector that is collinear to the face-centered normal vector of the thermal interface of the heat source. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of mating force directed through the gimbal joint to the heat collection device. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.
REFERENCES:
patent: 3320351 (1967-05-01), Glickman
patent: 3509430 (1970-04-01), Mroz
patent: 3874549 (1975-04-01), Hascoe
patent: 4203488 (1980-05-01), Johnson et al.
patent: 4235285 (1980-11-01), Johnson et al.
patent: 4345267 (1982-08-01), Corman et al.
patent: 4504850 (1985-03-01), Pollard et al.
patent: 4716494 (1987-12-01), Bright et al.
patent: 4978638 (1990-12-01), Buller et al.
patent: 5397919 (1995-03-01), Tata et al.
patent: 5621615 (1997-04-01), Dawson et al.
patent: 5672980 (1997-09-01), Charlton et al.
patent: 5830806 (1998-11-01), Hudson et al.
patent: 5882248 (1999-03-01), Wright et al.
patent: 5886870 (1999-03-01), Omori
patent: 5923086 (1999-07-01), Winer et al.
patent: 6014315 (2000-01-01), McCullough et al.
patent: 6021045 (2000-02-01), Johnson
patent: 6058014 (2000-05-01), Choudhury et al.
patent: 6084178 (2000-07-01), Cromwell
patent: 6116331 (2000-09-01), Tustaniwskyj et al.
patent: 6179047 (2001-01-01), Tustaniwskyj et al.
patent: 6196299 (2001-03-01), Tustaniwskyj et al.
patent: 6282093 (2001-08-01), Goodwin
patent: 6347036 (2002-02-01), Yeager et al.
patent: 6374906 (2002-04-01), Peterson et al.
patent: 6392431 (2002-05-01), Jones
patent: 6425515 (2002-07-01), Mays et al.
patent: 6449157 (2002-09-01), Chu
patent: 6449162 (2002-09-01), Corbin, Jr. et al.
patent: 6459582 (2002-10-01), Ali et al.
patent: 6462951 (2002-10-01), Letourneau
patent: 6469893 (2002-10-01), Frutschy et al.
patent: 6512509 (2003-01-01), McVicar
patent: 6699791 (2004-03-01), Hofmann et al.
patent: 6724632 (2004-04-01), Lee et al.
patent: 6741470 (2004-05-01), Isenburg
patent: 6778395 (2004-08-01), Dong et al.
patent: 6936919 (2005-08-01), Chuang et al.
patent: 6977816 (2005-12-01), Lee et al.
patent: 7009843 (2006-03-01), Lee et al.
patent: 2001/0006874 (2001-07-01), Moore
patent: 2004/0091311 (2004-05-01), Lin
patent: 2004/0134639 (2004-07-01), Franke et al.
patent: 2004/0139756 (2004-07-01), Wall et al.
patent: 2005/0140383 (2005-06-01), Inoue et al.
patent: 2005/0214173 (2005-09-01), Facer et al.
patent: 2006/0164807 (2006-07-01), Reyzin et al.
Brewer Richard Grant
Corbin Dave
Herms Richard
McMaster Mark
Munch Mark
Cooligy Inc.
Haverstock & Owens LLP
Thompson Gregory D
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