Self-releasing spring structures and methods

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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Details

C438S666000, C438S678000, C257SE21587, C257SE21592

Reexamination Certificate

active

07943504

ABSTRACT:
According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing layer is disclosed, wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer. Moreover, a method of manufacturing a spring device, according to various exemplary embodiments, includes providing a substrate, providing a self-releasing layer over the substrate and providing a stressed-metal layer over the self-releasing layer wherein an amount of stress inside the stressed-metal layer results in a peeling force that is higher than an adhesion force between the self-releasing layer and the stressed-metal layer is also disclosed in this invention.

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Kataoka et al., “Low Contact-Force and Compliant Mems Probe Card Utilizing Fritting Contact,” IEEE, pp. 364-367, 2002.
Modi et al., “Effect of Adhesive Layer Properties on Interfacial Fracture in Thin-Film High-Density Interconnects,” ECTC, San Diego, California, 2002.

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