Self-positioning heat spreader

Details Self-positioning heat spreader Self-positioning heat spreader

1984-04-02

1985-09-10

James, Andrew J.

357 72, 357 68, H01L 2330, H01L 2336

Patent

active

045410054

ABSTRACT:
A heat spreader which is self-positioning into a mold cavity prior to encapsulation in plastic is provided. To minimize capacitance between the spreader and a metal lead frame having a semiconductor die mounted thereon, the heat spreader has a frame with notches in the opposite ends which define bifurcated limbs. Lateral standoffs extend from each of the sides thereof and feet extend from the bottom surface thereof. A central portion extends a predetermined distance from the top surface thereof for intimate positioning with the lead frame. The standoffs, limbs and feet are sized to firmly position the heat spreader upon insertion into the mold cavity. To maintain substantially constant capacitance between the spreader and the lead frame from part to part, each bifurcated limb has an inner edge which complements or conforms to the portion of the lead frame which will overlay the limb in the encapsulated plastic.

REFERENCES:
patent: 3908185 (1975-09-01), Martin
patent: 4132856 (1979-02-01), Hutchison et al.
patent: 4392152 (1983-07-01), Hirano

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