Static information storage and retrieval – Read/write circuit – Differential sensing
Reexamination Certificate
2000-05-12
2001-10-09
Nguyen, Tan T. (Department: 2818)
Static information storage and retrieval
Read/write circuit
Differential sensing
C365S203000
Reexamination Certificate
active
06301179
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Technical Field
The present invention relates generally to sense amplifier circuits and, more particularly, to sense amplifier circuits.
2. Description of the Related Art
Sense amplifiers for use in memory arrays are well known. A typical sense amplifier is used to detect signals of low power received from the cells within the memory array and convert the signals to power levels compatible with the rest of the system in which the memory is used at a high speed. As memory density increases, the memory cell size and the corresponding cell output signal power is reduced, thereby making the sense amplifier critical for achieving satisfactory power output in the high speed read out of memory cells in a high density memory.
A conventional sense amplifier detects the memory cell output through a differential amplifier, which is highly sensitive, but has very small voltage gain. The output signals from a memory cell are in the form of electric charges, which change the charge level at input junctions of the sense amplifier. In order to obtain a reliable, rapid readout of the memory cell, the input functions of the sense amplifier need to be precharge, between memory cell readouts, to the same voltage level. This process is called equalization.
An example of a sense amplifier of the prior art is shown in FIG.
1
. As shown in this figure, the sense amplifier comprises a series of P-FETs and N-FETs. In a FET, the term “source” is used to refer to the end terminal at which carriers are introduced into the conductive path of the FET and the term “drain” is used to refer to the end terminal which receives the carriers from the conductive path. The source and drain are structurally identical and, accordingly, are interchangeable. Complementary signals, cdlt and cdlc, are applied to the sense amplifier on lines
16
and
18
when a memory cell is read out. Complementary signals are a pair of binary signals, each of which represent binary values with opposite signal levels. In the case of the signals cdlt and cdlc, when the cdlt signal is at relatively high voltage when a memory cell is being read out, the cdlc signal will be relatively low and vice versa. In the sense amplifier of
FIG. 1
, the complementary memory output signals cdlt and cdlc are applied to the gates of N-FETs
17
and
19
, respectively. The lower terminals of the FETs
17
or
19
, serving as sources, are connected together and through a series connection of N-FETs
21
and
23
to ground. The upper terminals of the N-FETs
17
and
19
, serving as drains, are connected through P-FETs
27
and
29
, respectively, to voltage source vdd at 3.3 volts. The drain of the N-FET
17
is connected to the gate of the N-FET
21
and is connected to the gates of the P-FETs
27
and
29
. An enable signal is connected to the gate of the N-FET
23
. The enable signal goes high during the cell readout and goes low between cell readouts. The drain of N-FET
19
is connected to the output junction
30
of the first stage of the sense amplifier and feeds an output amplification stage
32
.
The circuit junction
34
at the gate of the N-FET
17
and the circuit junction
36
at the gate of the N-FET
19
are precharge through a circuit comprising N-FETs
38
,
40
and
42
. The N-FET
38
is connected between the circuit junction
34
and the voltage source vdd. The N-FET
40
is connected between the junction
36
and the voltage source vdd. The N-FET
42
is connected between the circuit junctions
34
and
36
. The output stage
32
comprises a P-FET
44
, an N-FET
46
and an N-FET
48
connected series between the voltage vdd and ground. The output junction
30
is connected to the gates of the P-FET and the N-FET
46
.
An enable_b signal, which is complementary to the enable signal, is applied to the gates of the N-FETs
38
,
40
and
42
and renders these FETs conductive between cell readouts and turns these N-FETs off during the cell readouts. As a result, between cell readouts, the junctions
34
and
36
will be shorted together through the N-FET
42
and will be precharge from the vdd source to an equalization voltage of 2.5 volts (3.3 volts minus the threshold voltage of 0.8 volts for the N-FETs
38
and
40
). During a memory cell readout, one of the circuit junctions
34
and
36
will be driven high by the complementary signals received from the memory cell and the other junction
34
or
36
will be driven low. When junction
36
is driven high and junction
34
is driven low, the N-FET
19
will be turned on and the N-FET
17
will be turned off. The turning off of the N-FET
17
will cause the gate of the N-FET
21
to go high turning on the N-FET
21
and will cause the gates of the P-FETs
27
and
29
to go high to cause these P-FETs to turn off. Since the enable signal during cell readout will be high, the N-FET
23
will be also conductive. As a result of the N-FETs
19
,
21
and
23
being rendered conductive, a conducting path will be established from the output junction
30
to ground and, as a result, the output junction
30
will discharge to a low potential. When the complementary input signals drive input junction
34
high and input junction
36
low, the FET
19
will be cut off and the output junction
30
will remain charged at a high potential. When the output junction
30
is high, conduction through the P-FET in the output stage
44
will be cut off and the N-FET
46
will be rendered conductive. As a result, output connector
50
of the sense amplifier, connected to the junction between the P-FET
44
and the N-FET
46
, will be cut off from the vdd voltage and will be connected through the conductive N-FETs
46
and
48
to ground so that the output voltage on connector
50
will go low. Conversely, when the output junction
30
is low, the N-FET
46
will become non-conductive and the P-FET
44
will become conductive. As a result, the output connector
50
will have a conductive path to the voltage source vdd and a high output voltage will be produced.
During the precharging of the input junctions
34
and
36
, the sense amplifier consumes power due to heavy capacitive loading on lines
16
and
18
. In addition, because the equalization voltage is relative high at 2.5 volts, more time is required to precharge the input junctions and the response of the sense amplifier to the complementary input signals is delayed because the precharge voltage is not close to the threshold at which the FETs
17
and
19
are switched between conductive ands nonconductive states.
For the reasons given above, and for reasons that will become apparent to those skilled in the art from reading and understanding the present specification, there is a need for a sense amplifier which takes less time to precharge the input junctions, which responds more rapidly to the output signals from a memory cell, and which consumes very little power.
SUMMARY OF THE INVENTION
The above-mentioned problems with sense amplifiers in the prior art are addressed by the present invention which will be understood by reading and studying the following specification.
The sense amplifier of the invention comprises a self-equalized low powered precharge circuit having rapid precharge capability and a low power requirement. Rapid precharge and a lower power requirement are achieved by virtue of a reduced equalization potential. In the present design, the equalization potential is close to the threshold level at which FETs in the sense amplifier receiving the output signals from a memory cell are switched between non-conductive and conductive states. The low equalization potential is achieved by precharging the input circuit junctions to 0.8 volts above ground through P-FETs. With the sense amplifier configured in this manner, the time to precharge the sense amplifier is reduced and very little power is consumed. The low equalization potential near the threshold of the N-FETs receiving the memory cell signals and the reduction in precharge time for the input junctions reduce the memory cell access time. The sense amp
Aitken Richard L.
BAE Systems Information and Electronic Systems Integration Inc.
Nguyen Tan T.
Venable
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