Self-assemblying micro-mechanical device

Details Self-assemblying micro-mechanical device Self-assemblying micro-mechanical device

1997-12-22

1999-11-30

Dutton, Brian

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

257415, 7351429, H01L 2100, H01L 2982, G01P 1500

Patent

active

059941596

ABSTRACT:
A self-assembling micron-sized mechanical device is described. The device comprises hinged plates attached to a support. A beam having a first end free to move in an upwardly-directed arc is associated with each hinged plate comprising the device. The beam has a first engagement member, including a first angled edge, disposed at its freely-movable first end. Each hinged plate includes a second engagement member, including a second angled edge. In the unassembled state, at least a portion of the first engagement member lies beneath the second engagement member on the support. Actuation force is applied to the beam by an actuator, the force causing the first end of the beam to lift. As it does so, the first and second angled edges slide over another, and the hinged plate is rotated upwardly about its hinges away from the support. The mechanical advantage provided by the angled edges allows a hinged plate to be rotated fully ninety degrees away from the support.

REFERENCES:
patent: 5867297 (1999-02-01), Kiang et al.
patent: 5912094 (1999-06-01), Aksyuk et al.
Cowan et al., "Vertical Thermal Actuators for Micro-Opto-Electro-Mechanical Systems," v.3226, SPIE, pp. 137-146, 1997.
Reid et al., "Automated Assembly of Flip-Up Micromirrors," Transducers '97, Proc. Int'l Conf. Solid-State Sensors and Actuators, Chicago, pp. 347-350, Jun. 1997.
Cowan et al., "Vertical Thermal Actuators for Micro-Opto-Electro-Mechanical Systems," v. 3226 S.P.I.E. pp. 137-46 (1997).
Reid et al., "Automated Assembly of Flip-Up Micromirrors," Transducers '97, Proc. Int'l Conf. Solid-State Sensors and Actuators, Chicago Jun. 16-19, 1997, pp. 347-350.

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