Self-assembled nanometer conductive bumps and method for...

Details Self-assembled nanometer conductive bumps and method for... Self-assembled nanometer conductive bumps and method for...

2006-01-24

2006-01-24

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

06989325

ABSTRACT:
A self-assembled nanometer conductive bump and a method for fabricating the bump. In the method, a multiplicity of carbon nanotubes that are coated at two ends with chemically functional groups is first provided. A substrate that is equipped with at least one bond pad on a surface is then positioned juxtaposed to the carbon nanotubes for forming a bond between the carbon nanotubes and the metal pads facilitated by a chemical affinity existed between the functional groups and the metal pad.

REFERENCES:
patent: 6515339 (2003-02-01), Shin et al.
patent: 6517995 (2003-02-01), Jacobson et al.
patent: 6737939 (2004-05-01), Hoppe et al.
patent: 6741019 (2004-05-01), Filas et al.
patent: 2001/0031900 (2001-10-01), Margrave et al.
patent: 2004/0075464 (2004-04-01), Samuelson et al.

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