Self-alignment process for thin film diode array fabrication

Details Self-alignment process for thin film diode array fabrication Self-alignment process for thin film diode array fabrication

1986-07-25

1987-07-07

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29572, 29591, 156653, 156657, 1566611, 156668, 357 4, 357 65, 427 88, 430313, 430317, B44C 122, C03C 1500, C03C 2506

Patent

active

046785426

ABSTRACT:
A self-alignment process for the fabrication of an array formed from a plurality of micron-scale solid state circuit elements operatively disposed upon a large area substrate. By the instant process electrical contact may be established with the upper electrode of the micron-scale solid state circuit elements without the necessity of masking.

REFERENCES:
patent: 3442647 (1969-05-01), Klasens
patent: 4381341 (1983-04-01), Przybysz et al.
patent: 4587720 (1986-05-01), Chemenas-Paule et al.

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