Self-aligning contacts for stacked electronics

Details Self-aligning contacts for stacked electronics Self-aligning contacts for stacked electronics

2005-02-01

2005-02-01

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S395000

Reexamination Certificate

active

06849388

ABSTRACT:
A method for providing self-aligned contact pads along an edge face of stacked electronics utilizes reflected light from the metal contact leads to define their location. A thin layer of light sensitive polymer is applied over the edge face, at which incident light is directed. A solvent developer is applied which dissolves the polymer where the reflected light passed. In a two-pass technique reflected light destroys an inhibitor in the polymer, and that portion of the layer is dissolved by a developer to delineate voids for contact pads. In a wavefront cancellation technique reflected light is 180° out of phase with the first pass of light, the combination not cross-linking molecules in the polymer, and that portion of the layer is dissolved to delineate voids for contact pads. In an alternative embodiment, a laser interrogation technique, a first incident light outside the absorption spectrum is reflected off the metal contacts leads, and a second incident light within the absorption spectrum is directed at the detected locations of the reflected light, those portions of the polymer in turn dissolved by the developer. The above method provides non-mechanical photo-lithographic techniques to accurately delineate voids for contact pads.

REFERENCES:
patent: 4379833 (1983-04-01), Canavello et al.
patent: 5981150 (1999-11-01), Aoki et al.
patent: 6031291 (2000-02-01), Sato et al.
patent: 6165896 (2000-12-01), Schnabel et al.

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