Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Reexamination Certificate
2008-07-29
2010-12-28
Fahmy, Wael M (Department: 2814)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
C438S195000, C438S196000, C438S199000, C438S587000, C438S591000, C257S346000, C257S024000, C257SE29069, C257SE21051
Reexamination Certificate
active
07858454
ABSTRACT:
A method is provided for forming a self-aligned carbon nanotube (CNT) field effect transistor (FET). According to one feature, a self-aligned source-gate-drain (S-G-D) structure is formed that allows for the shrinking of the gate length to arbitrarily small values, thereby enabling ultra-high performance CNT FETs. In accordance with another feature, an improved design of the gate to possess a “T”-shape, referred to as the “T-Gate,” thereby enabling a reduction in gate resistance and further providing an increased power gain. The self-aligned T-gate CNT FET is formed using simple fabrication steps to ensure a low cost, high yield process.
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PCT Notification of Transmittal of the International Search Report, and the Written Opinion of the International Searching Authority, or the Declaration (PCT Rule 44.1), Jan. 30, 2009, 12 pages.
Armand Marc
Blanche Bradley D.
Fahmy Wael M
Greenberg & Traurig, LLP
RF Nano Corporation
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