Self-aligned nonnested sloped via

Details Self-aligned nonnested sloped via Self-aligned nonnested sloped via

1987-07-31

1989-06-27

Dees, Jose G.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430317, 430318, 430330, 437175, 437228, 437229, G03C 500

Patent

active

048429910

ABSTRACT:
A via (64, 66, 68) comprises a conductor (45, 46, 48) having a first surface (58, 60, 62) and at least one second surface (49) that forms at least one edge (52) with the first surface (58, 60, 62). A first insulator layer (33) is formed on the first surface and defines a first area (58, 60, 62) on the conductor that is not covered by the first insulator layer (33). A second insulator layer (70) is formed over the second surface (49). The first and second insulator layers (33, 70) define a via (64, 66 and 68) to the conductor (45, 46, 48) . The bottom area (58, 60, 62) of the via (64, 66, 68) is equal to the first area and is bounded in part by the edge (52).

REFERENCES:
patent: 4614021 (1986-09-01), Hulseweh
patent: 4764484 (1988-08-01), Mo
patent: 4789648 (1988-12-01), Chow et al.

Affiliated with

Also associated with

Rating

Self-aligned nonnested sloped via does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Self-aligned nonnested sloped via, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Self-aligned nonnested sloped via will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-813220