Self-aligned mechanical joint between die and substrate...

Details Self-aligned mechanical joint between die and substrate... Self-aligned mechanical joint between die and substrate...

2007-04-03

2007-04-03

Edmondson, Lynne R. (Department: 1725)

Electric heating

Microwave heating

Field modification

C219S600000, C219S634000, C228S234100

Reexamination Certificate

active

10624830

ABSTRACT:
The present invention includes a mechanical joint between a die and a substrate that is reflowed by microwave energy and a method of forming such a mechanical joint by printing a solder over a substrate, placing the solder in contact with a bump over a die, reflowing the solder with microwave energy, and forming a mechanical joint from the solder and the bump.

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