Self-aligned low-k gate cap

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257SE27060, C257SE21626, C257SE21640

Reexamination Certificate

active

10904391

ABSTRACT:
A CMOS structure in which the gate-to-drain/source capacitance is reduced as well as various methods of fabricating such a structure are provided. In accordance with the present invention, it has been discovered that the gate-to-drain/source capacitance can be significantly reduced by forming a CMOS structure in which a low-k dielectric material is self-aligned with the gate conductor. A reduction in capacitance between the gate conductor and the contact via ranging from about 30% to greater than 40% has been seen with the inventive structures. Moreover, the total outer-fringe capacitance (gate to outer diffusion+gate to contact via) is reduced between 10–18%. The inventive CMOS structure includes at least one gate region including a gate conductor located atop a surface of a semiconductor substrate; and a low-k dielectric material that is self-aligned to the gate conductor.

REFERENCES:
patent: 6194748 (2001-02-01), Yu
patent: 6335248 (2002-01-01), Mandelman et al.
patent: 6383878 (2002-05-01), Huang
patent: 6607952 (2003-08-01), Yagishita et al.
patent: 6724051 (2004-04-01), Woo et al.
patent: 6924184 (2005-08-01), Cave et al.
patent: 2002/0079557 (2002-06-01), Ahn et al.
patent: 2004/0063264 (2004-04-01), Zheng et al.
patent: 2004/0155276 (2004-08-01), Iwasaki et al.

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