Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1991-12-30
1999-03-09
Chaudhuri, Olik
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438696, H01L 21336, H01L 21441, H01L 23522
Patent
active
058800220
ABSTRACT:
A self aligned contact to the substrate in the region between two gate electrodes is formed by depositing a conformal dielectric layer and patterning to form a contact window. The conductive elements of the gate electrode are not contacted because of etch rate differentials between the conformal dielectric and the insulating elements of the gate structure.
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Lee Kuo-Hua
Yu Chen-Hua Douglas
Chaudhuri Olik
Laumann Richard D.
Lucent Technologies - Inc.
Mai A. D.
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