Self-aligned air-gap in interconnect structures

Details Self-aligned air-gap in interconnect structures Self-aligned air-gap in interconnect structures

2011-01-18

2011-01-18

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S623000, C438S624000, C438S625000, C438S626000

Reexamination Certificate

active

07871923

ABSTRACT:
An integrated circuit structure comprising an air gap and methods for forming the same are provided. The integrated circuit structure includes a conductive line; a self-aligned dielectric layer on a sidewall of the conductive line; an air-gap horizontally adjoining the self-aligned dielectric layer; a low-k dielectric layer horizontally adjoining the air-gap; and a dielectric layer on the air-gap and the low-k dielectric layer.

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