Selectively stripping tin or tin-lead alloys from copper substra

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156635, 252 794, 252 793, C09K 1308

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active

040049566

ABSTRACT:
Acidic solutions for selectively stripping tin or tin-lead alloys from copper substrates comprising an aqueous solution of at least one nitro-substituted aromatic compound; an inorganic acid capable of readily reacting with tin and lead to form water-soluble salts thereof and incapable of reacting with tin and lead to form a water-insoluble compound film on the tin or tin-lead alloy surface, preferably fluoboric acid; a thiourea; an organic acid of the formula RCOOH wherein R is 1-2C alkyl or hydrogen; and a haloacetic acid wherein the halogen is chloro or bromo. The haloacetic acid in combination with the acid of the formula RCOOH result in a pronounced synergism in accelerating the rate of stripping the tin or tin-lead alloy deposit from the copper substrate.

REFERENCES:
patent: 2652360 (1953-09-01), Bond et al.
patent: 3061494 (1962-10-01), Snyder et al.
patent: 3677949 (1972-07-01), Brindisi et al.
patent: 3888778 (1975-06-01), Beckwith et al.

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