Selectively etching microstructures in a glow discharge plasma

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29 2535, 156646, 1566591, 156663, 156904, 156345, 20419232, 204298, B44C 122, C03C 1500, C03C 2506

Patent

active

046541187

ABSTRACT:
Selective etching of microelectronic devices comprising crystal substrates s achieved by electrically masking conductive areas thereon which are not to be etched by ionic bombardment. The electrical masking is accomplished by biasing the selected areas with a bias voltage which will repel the ions, which are attracted to all of the unbiased portions of the microelectronic device.

REFERENCES:
patent: 3410774 (1968-11-01), Barson et al.

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