Selective solder formation on printed circuit boards

Details Selective solder formation on printed circuit boards Selective solder formation on printed circuit boards

1988-09-26

1990-12-18

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156664, 156901, H05K 306

Patent

active

049784234

ABSTRACT:
Disclosed is a method of providing solder on selected portions of a printed circuit board. Solder is first electroplated over copper conductor patterns on the board by means of a first photoresist layer. After stripping the first photoresist, a second photoresist layer is laminated over the board and developed to expose selected portions of the solder. The exposed portions are selectively stripped. The copper exposed by the selective stripping is then subjected to a scrubbing while the photoresist protects the remaining solder, and the second photoresist is removed.

REFERENCES:
patent: 3240684 (1966-03-01), Martin et al.
patent: 3576630 (1971-04-01), Yanagawa
patent: 4004956 (1977-01-01), Brindisi, Jr.
patent: 4216246 (1980-08-01), Iwasaki et al.
patent: 4306933 (1981-12-01), DaFonte, Jr.
patent: 4319955 (1982-03-01), Murski
patent: 4487828 (1984-12-01), Hladovcak et al.
Hackh's Chemical Dictionary, 4th Ed., McGraw-Hill, New York, 1969, pp. 622-623.

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