Selective removal of coating material on a coated substrate

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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Details

427240, 427273, B05D 312, G03C 176, G03C 300

Patent

active

045186782

ABSTRACT:
In accordance with the invention, an improvement in the process for the production of a plurality of semiconductor devices from a single substrate comprises contacting at least one surface of the substrate adjacent the peripheral edge thereof with means capable of rendering the coating material into a selectively more easily removable form than the remainder of the coating material. Selective peripheral portions of the coating material are then removed which mitigates the inadvertant dislodgement of coating particles from the peripheral portion of the substrate during subsequent processing of the coated substrate. In a preferred embodiment, the coating material is removed by contacting the peripheral portions of the coated substrate with a chemical which is a solvent for the coating.

REFERENCES:
patent: 4113492 (1978-09-01), Sato et al.

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